I got quite a few questions on what get I used to encapsulate the IMU. The gel is the Dow Corning Sylgard 527, the consistency of the gel is controlled by the proportion of part A vs. part B. I used 70% part B and 30% part A. After you mix the two parts you need to heat the mix (and the board in it) in order to cure. I put it in an oven at about 70 degC for 2 hours. It will also cure at room temperature but it may take several days.
Very cool.
What type of container is it in? Any chance of getting a side view as well
Nice work.
-Jamie
It is in a epoxy mixing container, the ones you get for a hobby shop, I had to cut it down a bit shorter. I will try to get a side view.
Vassilis,
That’s a very clever idea. I too have been investigating means of reducing vibration, but I was looking in the direction of active vibration/noise cancellation. I’ve seen something similar to what you’ve done in rockets with large g forces, to protect electronics. Also, in avionics, at times they pour epoxy on electronics circuits to protect it against vibration. Do you have any comparative results to show quantitative analysis for before and after, and how it would compare to let’s say if you only used shock mounts? Even without any comparative analysis, you can still stay that it will protect the circuit.
Again, a very clever idea.
-pk
You could add microbaloons to make it lighter, and see if it still works well enough.